Invention Application
- Patent Title: CONTACTING SOI SUBSTRATES
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Application No.: US15375890Application Date: 2016-12-12
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Publication No.: US20170104005A1Publication Date: 2017-04-13
- Inventor: Christian Haufe , Ingolf Lorenz , Michael Zier , Ulrich Gerhard Hensel , Navneet Jain
- Applicant: GLOBALFOUNDRIES Inc.
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L21/84 ; H01L29/06 ; H01L29/49

Abstract:
An integrated circuit is provided including a semiconductor bulk substrate, a buried oxide layer formed on the semiconductor bulk substrate, a plurality of cells, each cell having a transistor device, formed over the buried oxide layer, a plurality of gate electrode lines running through the cells and providing gate electrodes for the transistor devices of the cells, and a plurality of tap cells configured for electrically contacting the semiconductor bulk substrate and arranged at positions different from positions below or above the plurality of cells having the transistor devices.
Public/Granted literature
- US10068918B2 Contacting SOI subsrates Public/Granted day:2018-09-04
Information query
IPC分类: