Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE ASSEMBLY WITH THROUGH SILICON VIA INTERCONNECT
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Application No.: US15393387Application Date: 2016-12-29
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Publication No.: US20170110406A1Publication Date: 2017-04-20
- Inventor: Ming-Tzong YANG , Cheng-Chou HUNG , Wei-Che HUANG , Yu-Hua HUANG , Tzu-Hung LIN , Kuei-Ti CHAN , Ruey-Beei WU , Kai-Bin WU
- Applicant: MediaTek Inc.
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L25/065 ; H01L23/498 ; H01L23/00 ; H01L21/768 ; H01L23/48

Abstract:
The invention provides a semiconductor package assembly with a TSV interconnect. The semiconductor package assembly includes a first semiconductor package mounted on a base, having: a semiconductor die, a semiconductor substrate, and a first array of TSV interconnects and a second array of TSV interconnects formed through the semiconductor substrate, wherein the first array and second array of TSV interconnects are separated by an interval region. The assembly further includes a second semiconductor die mounted on the first semiconductor package, having a ground pad thereon. One of the TSV interconnects of the first semiconductor package has a first terminal coupled to the ground pad of the second semiconductor die and a second terminal coupled to an interconnection structure disposed on a front side of the semiconductor substrate.
Public/Granted literature
- US09947624B2 Semiconductor package assembly with through silicon via interconnect Public/Granted day:2018-04-17
Information query
IPC分类: