- 专利标题： ANTIFUNGAL COMPOUNDS AND PROCESSES FOR MAKING
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申请号： US15317006申请日： 2016-03-17
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公开(公告)号： US20170121307A1公开(公告)日： 2017-05-04
- 发明人: William J. Hoekstra , David Dale Wirth , Tracy Ehiwe , Thierry Bonnaud
- 申请人： Viamet Pharmaceuticals, Inc.
- 国际申请： PCT/US2016/022858 WO 20160317
- 主分类号： C07D401/06
- IPC分类号： C07D401/06
摘要：
The present invention relates to polymorphic forms of compound 1 or 1a and processes for preparing compound 1 and 1a polymorphs, which are useful as antifungal agents. In particular, the invention seeks to provide a new methodology for preparing polymorphs of compound 1 and substituted derivatives thereof.
公开/授权文献
- US09840492B2 Antifungal compounds and processes for making 公开/授权日：2017-12-12
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