- 专利标题: POLY(IMIDE-AMIDE) COPOLYMER, A METHOD FOR PREPARING A POLY(IMIDE-AMIDE) COPOLYMER, AND AN ARTICLE INCLUDING A POLY(IMIDE-AMIDE) COPOLYMER
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申请号: US15346876申请日: 2016-11-09
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公开(公告)号: US20170130004A1公开(公告)日: 2017-05-11
- 发明人: Hongkyoon CHOI , Chanjae AHN , Hyunjeong JEON , Sang Soo JEE , Sungwon CHOI , Sung Woo HONG , Byunghee SOHN
- 申请人: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
- 优先权: KR10-2015-0156846 20151109
- 主分类号: C08G73/14
- IPC分类号: C08G73/14 ; C09J179/08 ; C09D179/08
摘要:
A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thererof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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