Invention Application
- Patent Title: POLY(IMIDE-AMIDE) COPOLYMER, A METHOD FOR PREPARING A POLY(IMIDE-AMIDE) COPOLYMER, AND AN ARTICLE INCLUDING A POLY(IMIDE-AMIDE) COPOLYMER
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Application No.: US15346876Application Date: 2016-11-09
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Publication No.: US20170130004A1Publication Date: 2017-05-11
- Inventor: Hongkyoon CHOI , Chanjae AHN , Hyunjeong JEON , Sang Soo JEE , Sungwon CHOI , Sung Woo HONG , Byunghee SOHN
- Applicant: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
- Priority: KR10-2015-0156846 20151109
- Main IPC: C08G73/14
- IPC: C08G73/14 ; C09J179/08 ; C09D179/08

Abstract:
A poly(imide-amide) copolymer including a structural unit represented by Chemical Formula 1; a structural unit represented by Chemical Formula 2; and any one of a structural unit represented by Chemical Formula 3, an amic acid precursor of the structural unit represented by Chemical Formula 3, and a combination thererof; wherein a cured material of the poly(imide-amide) copolymer may have a tensile modulus of greater than or equal to about 5.5 GPa, and a yellowness index of less than or equal to about 5: wherein, groups and variables in Chemical Formulae 1 and 3 are the same as described in the specification.
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