One or more embodiments are directed to semiconductor packages having an integrated heatsink and methods of forming same. In one embodiment, a package includes a plurality of leads that support and enclose periphery portions of the semiconductor die. The leads have first and second, opposing surfaces that form outer surfaces of the package. The first surface of the leads may form a heatsink and the second surface of the leads form lands of the package for coupling to another device, substrate, or board. The package includes encapsulation material that surrounds the semiconductor die and located between upper portions of the leads. The package further includes a back filling material (or insulating material) that is below the semiconductor die and between lower portions of the leads.