Invention Application
- Patent Title: Electromagnetic Shielding Material and Method for Packaging Optical Module
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Application No.: US15420972Application Date: 2017-01-31
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Publication No.: US20170142871A1Publication Date: 2017-05-18
- Inventor: Min Zhou , Huafeng Lin , Zhenxing Liao
- Applicant: Huawei Technologies Co., Ltd.
- Main IPC: H05K9/00
- IPC: H05K9/00 ; G02B6/42

Abstract:
Embodiments provide an electromagnetic shielding material and a method for packaging an optical module, where the electromagnetic shielding material includes an electromagnetic shield layer. The electromagnetic shield layer includes an external flux guide layer, an insulation medium layer, and an internal flux guide layer. The external flux guide layer is of a mesh structure, and each mesh forms a first guiding unit. The first guiding unit is of a tapered structure, and the guiding unit forms a first included angle with a horizontal direction. The first included angle is greater than 0 degrees and less than 90 degrees. A cross section of the electromagnetic shield layer is in a sawtooth shape.
Public/Granted literature
- US10178817B2 Electromagnetic shielding material and method for packaging optical module Public/Granted day:2019-01-08
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