A system for elastically compensating for wear, thermal expansion and misalignment comprises a ring located between a housing and a pin in the bore of the housing. The ring has a backing layer, an expanded grid structure having a plurality of openings, a low friction layer penetrated into the openings of the expanded grid structure, and adhesive for bonding the backing layer, expanded grid structure and low friction layer together to provide elastic deformation of the ring between the housing and pin.