Invention Application
- Patent Title: ENCAPSULATION METHOD OF AN OLED AND OLED DEVICE
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Application No.: US15113596Application Date: 2015-10-23
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Publication No.: US20170149009A1Publication Date: 2017-05-25
- Inventor: Deming Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Priority: CN201510386986.5 20150630
- International Application: PCT/CN2015/092684 WO 20151023
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56

Abstract:
An encapsulation method of an OLED and an OLED device are provided, and the method includes: providing a substrate for encapsulation (401) and a cover plate (403); forming a conductive frame (402) on the substrate for encapsulation (401); cell assembling the substrate for encapsulation (401) which is provided with the frame (402) and the cover plate (403) to obtain a preforming device; placing the preforming device into a plating tank, and energizing the frame (402), wherein a metal thin film (404) is formed on a surface of the frame (402) close to the outside edge of the substrate (401). A layer of metal film (404) is plated at the periphery of the frame (402). Because the blocking effect of the compact structure of the metal thin film (404) to water and oxygen is better than that of a sealing frame cement, thus an OLED device made by the encapsulation method has better sealing effect and better performance.
Public/Granted literature
- US09985243B2 Encapsulation method of an OLED and OLED device Public/Granted day:2018-05-29
Information query
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