A multilayer printed circuit board comprising: i) a plurality of circuit board layers disposed in parallel planes to one another; ii) an outer via forming an electrical connection between a conductor contact on a first circuit board layer and a conductor contact on a second circuit board layer, wherein the outer via has a hollow central core; and iii) an inner via formed within the hollow central core of the outer via. The inner via forms an electrical connection between a conductor contact on a third circuit board layer and a conductor contact on a fourth circuit board layer. The inner via and the outer via are substantially concentric cylinders.