- 专利标题： HOUSING FOR ELECTROIC DEVICE AND METHOD FOR MAKING SAME
-
申请号： US15434064申请日： 2017-02-16
-
公开(公告)号： US20170157978A1公开(公告)日： 2017-06-08
- 发明人: YU-TSAI WANG , YING-BO YANG , SHUI-YING CHEN , BI-LING DONG
- 申请人： SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD. , FIH (HONG KONG) LIMITED
- 优先权： CN201510199459.3 20150424
- 主分类号： B44F1/08
- IPC分类号： B44F1/08 ; B05D3/02 ; B05D3/06 ; B05D1/02
摘要：
A method of making a housing comprises: providing a ceramic body; forming a pattern layer on a surface of the ceramic body to form an embedding member, wherein the pattern layer comprises at least one pattern, the pattern layer is made of thermo-sensitive ink material, and forming a base to integrated with the ceramic body formed with the least one pattern.
公开/授权文献
- US10245882B2 Housing for electroic device and method for making same 公开/授权日：2019-04-02
信息查询
