- 专利标题: Metallizing MEMS Devices
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申请号: US14963998申请日: 2015-12-09
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公开(公告)号: US20170166439A1公开(公告)日: 2017-06-15
- 发明人: Bradley C. Kaanta
- 申请人: Analog Devices, Inc.
- 主分类号: B81B7/00
- IPC分类号: B81B7/00 ; B81C1/00
摘要:
Various embodiments produce a semiconductor device, such a MEMS device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.
公开/授权文献
- US09758367B2 Metallizing MEMS devices 公开/授权日:2017-09-12
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