- 专利标题： METHOD FOR ADHERING METAL LAYER AND POLYMER LAYER AND METHOD FOR MANUFACTURING METAL ELECTRODE
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申请号： US15223505申请日： 2016-07-29
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公开(公告)号： US20170173933A1公开(公告)日： 2017-06-22
- 发明人: Yong Hee KIM , Sang-Don JUNG
- 申请人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 优先权： KR10-2015-0181042 20151217
- 主分类号： B32B37/12
- IPC分类号： B32B37/12 ; B32B38/10 ; C25D3/56 ; B32B37/26 ; C23F1/02 ; B32B37/14
摘要：
A method for adhering a metal layer and a polymer layer includes forming a metal layer, forming a nanoporous metal structure on the metal layer, and compressing a polymer layer on the nanoporous metal structure such that a polymer is infiltrated into the nanoporous metal structure.
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