发明申请
- 专利标题： SEMICONDUCTOR DEVICE
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申请号： US15465427申请日： 2017-03-21
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公开(公告)号： US20170194234A1公开(公告)日： 2017-07-06
- 发明人: Kenji FUJII , Yasumasa KASUYA , Mamoru YAMAGAMI , Naoki KINOSHITA , Motoharu HAGA
- 申请人： ROHM CO., LTD.
- 优先权： JP2014-079923 20140409; JP2014-079924 20140409; JP2014-079925 20140409; JP2015-056472 20150319
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00 ; H01L23/31
摘要：
A semiconductor device has a semiconductor element provided with a functional surface on which a functional circuit is formed and with a back surface facing in the opposite direction to the functional surface, while also having a lead supporting the semiconductor element and electrically connected to the semiconductor element, and a resin package covering at least a portion of the semiconductor element and the lead. The semiconductor element has a functional surface side electrode formed on the functional surface and equipped with a functional surface side raised part that projects in the direction in which the functional surface faces. The functional surface side raised part of the functional surface side electrode is joined to the lead by solid state bonding.
公开/授权文献
- US09899300B2 Semiconductor device 公开/授权日：2018-02-20
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