Invention Application
- Patent Title: HIGH FREQUENCY SIGNAL TERMINATION DEVICE
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Application No.: US15005784Application Date: 2016-01-25
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Publication No.: US20170194927A1Publication Date: 2017-07-06
- Inventor: Seunghwan Yoon
- Applicant: Broadcom Corporation
- Main IPC: H03H5/00
- IPC: H03H5/00 ; H05K3/30 ; H05K3/40 ; H03H3/00

Abstract:
A high frequency termination device includes a printed circuit board. A ground pad having a first predetermined inductive reactance at a resonant frequency can be mounted on the printed circuit board. A resistor landing pad having a second predetermined inductive reactance at the resonant frequency can be mounted on the printed circuit board. The resistor landing pad can be selectively positioned adjacent to the ground pad to create a desired capacitive reactance at the resonant frequency to cancel at least part of the first predetermined inductive reactance and the second predetermined inductive reactance. A terminating resistor can be coupled with the resistor landing pad. An impedance of the termination device is dominated by a resistance value of the terminating resistor at the resonant frequency due to cancellation of at least part of the first predetermined inductive reactance and the second predetermined inductive reactance at the resonant frequency.
Public/Granted literature
- US09825605B2 High frequency signal termination device Public/Granted day:2017-11-21
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