A nozzle retention arrangement is provided for an injection molding manifold system, such as a hot runner manifold system. The nozzle retention arrangement couples an injection nozzle to a distribution manifold in a manner that locates the nozzle in its final operating position and applies an initial assembly load to retain the nozzle in position on the manifold to facilitate installation of a manifold system into a manifold plate. The nozzle retention arrangement may provide a compliant load application feature to limit sealing surface pressure between the nozzle and the manifold to prevent surface damage between the components, while also accommodating thermal expansion of the heated components during operation of the system. The nozzle retention arrangement may also provide a load control feature to prevent the machining quality of the nozzle bore in the manifold plate from determining the sealing load between the nozzle and the manifold.