- 专利标题: COMPOSITION FOR PREPARING ARTICLE INCLUDING POLYIMIDE OR POLY(IMIDE-AMIDE) COPOLYMER, ARTICLE INCLUDING POLYIMIDE OR POLY(IMIDE-AMIDE) COPOLYMER, AND ELECTRONIC DEVICE INCLUDING THE ARTICLE
-
申请号: US15419019申请日: 2017-01-30
-
公开(公告)号: US20170218200A1公开(公告)日: 2017-08-03
- 发明人: Chanjae AHN , Sungwon CHOI , Byunghee SOHN , A Ra JO , Kyeong-sik JU , Sang Soo JEE , Hongkyoon CHOI
- 申请人: SAMSUNG ELECTRONICS CO., LTD. , Samsung SDI Co., Ltd.
- 优先权: KR10-2016-0009972 20160127
- 主分类号: C08L79/08
- IPC分类号: C08L79/08 ; C08G73/10 ; C08G73/14
摘要:
A composition for preparing an article including a polyimide or poly(imide-amide) copolymer, the composition including (1) a solution including at least one of (i) a polymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2; and (ii) a copolymer including at least one selected from a structural unit represented by Chemical Formula 1 and a structural unit represented by Chemical Formula 2, and a structural unit represented by Chemical Formula 3, and (2) a metallic salt soluble in the solution of the polymer and/or the copolymer, wherein the metallic salt is a salt of a metal selected from a Group 1 element, a Group 11 element, a Group 13 element, and a Group 14 element: wherein in Chemical Formulae 1 to 3, A, B, D, and E are the same as defined in the detailed description.