- 专利标题： RESISTIVE FILM WITH DUCTILE PARTICLES
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申请号： US15500907申请日： 2014-07-31
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公开(公告)号： US20170235246A1公开(公告)日： 2017-08-17
- 发明人: Thomas Anthony , Seongsik Chang
- 申请人： Thomas ANTHONY , Seongsik CHANG , Hewlett-Packard Development Company, L.P.
- 国际申请： PCT/US2014/049144 WO 20140731
- 主分类号： G03G15/02
- IPC分类号： G03G15/02 ; C23C16/44
摘要：
A resistive film is applied to a conductive substrate. Ductile particles are disposed substantially uniformly throughout the resistive film. Brittleness of the resistive film is thereby reduced.
公开/授权文献
- US09846381B2 Resistive film with ductile particles 公开/授权日：2017-12-19
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