A method includes: a first step of designing the semiconductor device by using CAD and outputting design CAD data; a second step of correcting the design CAD data to correspond to a matching trial object of the semiconductor device and outputting corrected CAD data; a third step of manufacturing the semiconductor device based on the design CAD data; a fourth step of capturing a tomographic image of the manufactured semiconductor device; a fifth step of comparing a shape and a dimension of a unit included in the semiconductor device between the tomographic image and the corrected CAD data; and a sixth step of determining that the matching trial object is failed when a difference therebetween as a result of the comparison in the fifth step is equal to or larger than a predetermined amount.