Invention Application
- Patent Title: Adhesion Promoting Material-Coated Electrically Conductive Carrier With Thermally Conductive Layer
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Application No.: US15501839Application Date: 2015-08-04
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Publication No.: US20170245358A1Publication Date: 2017-08-24
- Inventor: Elisabeth Kreutzwiesner , Gernot Schulz
- Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Priority: DE102014111145.1 20140805
- International Application: PCT/EP2015/067983 WO 20150804
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K1/11 ; H05K3/22 ; C23C16/27 ; H01L23/373 ; H01L21/48 ; C23C14/06 ; C23C14/34 ; H05K1/09 ; H01L23/498
Abstract:
A composite structure for use as a constituent of a mounting device, wherein the composite structure comprises an electrically conductive carrier, an intermediate layer comprising adhesion promoting material and being arranged on the electrically conductive carrier, and a thermally conductive and electrically insulating layer on the intermediate layer.
Information query
