Invention Application
- Patent Title: THERMO-COMPRESSION BONDING OF THERMOELECTRIC MATERIALS
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Application No.: US15512116Application Date: 2015-09-17
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Publication No.: US20170250334A1Publication Date: 2017-08-31
- Inventor: Wilfried HERMES , Markus SCHWIND , Juergen MOORS , Mathias WEICKERT
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Priority: EP14185294.7 20140918
- International Application: PCT/EP2015/071271 WO 20150917
- Main IPC: H01L35/34
- IPC: H01L35/34 ; H01L35/22 ; H01L35/08
Abstract:
The invention relates to the use of thermo-compression bonding (TCB) for bonding electrically conductive contacts to thermoelectric material pieces, respective processes and thermoelectric modules which are suitable for fitting in the exhaust system of an internal combustion engine.
Information query
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