An object stage and a hot pressing apparatus are disclosed. The object stage includes a base (1) and a support device (2) fixed on the base (1), wherein the support device (2) includes a plurality of detachable support sub-devices (21): the support device is configured to allow a printed circuit board (3) with at least one protruding structure (4) to be placed thereon, and no support sub-device (21) is disposed at a position on the support device (2) corresponding to the protruding structure (1). The object stage reduces manufacture cost, saves production time and improves production efficiency.