Invention Application
- Patent Title: ARRANGEMENT HAVING A PLURALITY OF CHIPS AND A CHIP CARRIER, AND A PROCESSING ARRANGEMENT
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Application No.: US15607735Application Date: 2017-05-30
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Publication No.: US20170263480A1Publication Date: 2017-09-14
- Inventor: Michael Ledutke , Edward Fuergut
- Applicant: Infineon Technologies AG
- Main IPC: H01L21/673
- IPC: H01L21/673 ; H01L23/31 ; H01L21/56 ; H01L21/66
Abstract:
In various embodiments, an arrangement is provided. The arrangement may include a plurality of chips; a chip carrier carrying the plurality of chips, the chip carrier including a chip carrier notch; and encapsulation material encapsulating the chip carrier and filling the chip carrier notch; wherein the outer circumference of the encapsulation material is free from a recess.
Public/Granted literature
- US10361138B2 Method for manufacturing an arrangement including a chip carrier notch Public/Granted day:2019-07-23
Information query
IPC分类:
