In electronic devices, as a result of miniaturization, the distance between a mounting board and an upper board or a shield case and the like, or the distance between the mounting board and other electronic components mounted adjacent thereto has become smaller. An electronic component is provided with: an element body internally containing a circuit element; and a terminal formed on the element body. The terminal is formed over an end surface of the element body and a surface adjacent to the end surface. An insulating film covering the terminal is formed on the element body. The terminal is exposed from the insulating film at least at a mounting surface of the element body, and a plating film containing tin is formed on a portion of the terminal exposed from the insulating film.