- 专利标题: SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
-
申请号: US15407422申请日: 2017-01-17
-
公开(公告)号: US20170271286A1公开(公告)日: 2017-09-21
- 发明人: YOUNGBAE KIM
- 申请人: SAMSUNG ELECTRONICS CO., LTD.
- 优先权: KR10-2016-0031631 20160316
- 主分类号: H01L23/00
- IPC分类号: H01L23/00
摘要:
A semiconductor device includes a semiconductor substrate including a circuit layer disposed therein, a bonding pad disposed on the semiconductor substrate, the bonding pad being electrically connected to the circuit layer, and a metal layer electrically connected to the bonding pad. The metal layer includes a first via electrically connected to the bonding pad, the first via providing an electrical path between the metal layer and the circuit layer, and a second via protruding toward the semiconductor substrate, the second via supporting the metal layer on the semiconductor substrate.