Aluminium Solder Alloy Free from Si Primary Particles and Method for Producing It
摘要:
The invention relates to an ingot consisting of an aluminium solder alloy having in percentage by weight 4.5%≦Si≦12%; and optionally one or more of the following alloying constituents in percentage by weight: Ti≦0.2%, Fe≦0.8%, Cu≦0.3%, Mn≦0.10%, Mg≦2.0%, Zn_23 0.20%, Cr≦0.05%, with the remainder aluminium and unavoidable impurities, individually at most 0.05 wt %, in total at most 0.15 wt %, wherein boron is additionally provided as an alloying constituent, wherein the boron content is at least 100 ppm and the aluminium alloy is free from primary Si particles having a size of more than 20 μm. The invention further relates to an aluminium alloy product consisting of an aluminium alloy, to an ingot consisting of an aluminium alloy and to a method for producing an aluminium alloy.
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