Invention Application
- Patent Title: LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD FOR PERFORMING LASER PROCESSING WHILE CONTROLLING REFLECTED LIGHT
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Application No.: US15478695Application Date: 2017-04-04
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Publication No.: US20170291258A1Publication Date: 2017-10-12
- Inventor: Takashi Izumi
- Applicant: FANUC CORPORATION
- Applicant Address: JP Yamanashi
- Assignee: FANUC CORPORATION
- Current Assignee: FANUC CORPORATION
- Current Assignee Address: JP Yamanashi
- Priority: JP2016-078281 20160408
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/70 ; B23K26/0622

Abstract:
A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.
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Information query
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