发明申请
- 专利标题: SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING OF ELEMENTS
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申请号: US15441013申请日: 2017-02-23
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公开(公告)号: US20170294398A1公开(公告)日: 2017-10-12
- 发明人: Akihiko HAPPOYA
- 申请人: KABUSHIKI KAISHA TOSHIBA
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/498 ; H01L23/31
摘要:
A semiconductor device includes a semiconductor chip covered with a resin layer, the semiconductor chip including an electrode pad at a surface of the semiconductor chip, a first insulating layer covering the surface of the semiconductor chip and having a via hole at a region corresponding to the electrode pad, a conductive layer extending along a surface of the electrode pad, a side surface of the via hole, and a planar surface the first insulating layer, to a region beyond a planar region defined by the semiconductor chip, a second insulating layer on the first insulating layer and covering the conductive layer; and a molecular bonding layer formed between the first insulating layer and the second insulating layer and including a molecular portion covalently bonded to a material of the conductive layer and a material of the second insulating layer.