- 专利标题: WIRING FORMING METHOD AND CIRCUIT BOARD
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申请号: US15523733申请日: 2014-11-07
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公开(公告)号: US20170318681A1公开(公告)日: 2017-11-02
- 发明人: Yoshitaka HASHIMOTO , Masatoshi FUJITA , Kenji TSUKADA , Akihiro KAWAJIRI , Masato SUZUKI
- 申请人: FUJI MACHINE MFG. CO., LTD.
- 申请人地址: JP Chiryu-shi
- 专利权人: FUJI MACHINE MFG. CO., LTD.
- 当前专利权人: FUJI MACHINE MFG. CO., LTD.
- 当前专利权人地址: JP Chiryu-shi
- 国际申请: PCT/JP2014/079539 WO 20141107
- 主分类号: H05K3/12
- IPC分类号: H05K3/12 ; C23C14/58
摘要:
To form wiring on circuit board and conductor body, metal ink containing metal particles is dispensed by inkjet head straddling the circuit board and the conductor body. Then, a laser is applied by laser emitting device to the dispensed metal ink. The metal ink to which the laser is applied is baked and wiring is formed. A laser corresponding to the laser emission amount per unit of area based on the material of the circuit board, which is resin, is applied to the metal ink on the circuit board, and a laser corresponding to the laser emission amount per unit of area based on the conductor body is applied to the metal ink on the conductor body. The metal ink on the circuit board and the metal ink on the conductor body is baked appropriately, and wiring is formed appropriately straddling the circuit board and the conductor body.
公开/授权文献
- US10212823B2 Wiring forming method and circuit board 公开/授权日:2019-02-19