- 专利标题： METHOD FOR MANUFACTURING HERMETIC SEALING LID MEMBER, HERMETIC SEALING LID MEMBER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT HOUSING PACKAGE
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申请号： US15527779申请日： 2015-11-17
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公开(公告)号： US20170330811A1公开(公告)日： 2017-11-16
- 发明人: Masayuki Yokota , Masaharu Yamamoto
- 申请人： HITACHI METALS, LTD.
- 申请人地址： JP Tokyo
- 专利权人： HITACHI METALS, LTD.
- 当前专利权人： HITACHI METALS, LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2014-250728 20141211
- 国际申请： PCT/JP2015/082189 WO 20151117
- 主分类号： H01L23/10
- IPC分类号： H01L23/10 ; H01L23/04 ; H03H9/10 ; H01L23/06 ; H03H9/13
摘要：
This method for manufacturing a hermetic sealing lid member (1, 201, 301) includes forming a Ni plated metal plate (70, 170) by forming a Ni plated layer (11, 12, 41) on a surface of a metal plate (40) having a corrosion resistance and forming the hermetic sealing lid member by punching the Ni plated metal plate.
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