A printed circuit board includes: a base substrate having a plurality of pad group areas arranged in a first direction on the base substrate, each of the pad group areas being divided into first, second, and third pad areas that are sequentially arranged in a second direction crossing the first direction; first and second row pads disposed within each of the pad group areas and arranged in a third direction crossing the first and second directions; first lines respectively connected to the first row pads; and lower dummy lines on a same layer as that of the first lines. Some of the first row pads are in the first pad area, rest of the first row pads and some of the second row pads are in the second pad area, and rest of the second row pads are in the third pad area.