Invention Application
- Patent Title: LEAD FRAME WITH SOLDER SIDEWALLS
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Application No.: US15684620Application Date: 2017-08-23
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Publication No.: US20170352609A1Publication Date: 2017-12-07
- Inventor: Dan Okamoto
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/78 ; H01L21/48
Abstract:
A leadframe wherein the outer sidewalls of the leadframe that are exposed by sawing during singulation are comprised of greater than 50% solder. A leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised of greater than 50% solder. A method of forming a leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised primarily of solder. A method of forming a leadframe strip wherein the saw streets and the outer surface of the lead frames are comprised entirely of solder.
Information query
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