The present disclosure provides an improved Rogowski-type current sensor. In order to allow the sensing coil and the compensation wire to overlap, the sensor is produced using two boards. The current sensing coil is provided on one board, and the compensation wire is provided on another board. The coil and the wire are arranged such that they at least partially overlap, and ideally the compensation wire is formed entirely within the area defined by the coil, albeit in a different plane. This arrangement makes the current sensor far better at rejecting interference than prior art PCB arrangements. In addition, the coil may be formed on a two-sided board. The board has upper radial elements formed on an upper surface, and lower radial elements formed on lower surface. The radial elements are connected using vias formed in the board. The upper radial elements are arranged in a first plane, and the lower radial elements are formed in a second parallel plane. The upper radial elements are arranged so that they are aligned with the lower radial elements, such that a pair of radial elements form a radial plane that is perpendicular to the board surface. This symmetry ensures excellent sensitivity to currents in a conductor.