Invention Application
- Patent Title: Reticle Cooling by Non-Uniform Gas Flow
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Application No.: US15540649Application Date: 2015-12-02
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Publication No.: US20170363973A1Publication Date: 2017-12-21
- Inventor: Thomas VENTURINO , Geoffrey Alan SCHULTZ , Daniel Nicholas GALBURT , Daniel Nathan BURBANK , Santiago E. DELPUERTO , Herman VOGEL , Johannes ONVLEE , Laurentius Johannes Adrianus VAN BOKHOVEN , Christopher Charles WARD
- Applicant: ASML Holding N.V. , ASML Netherlands B.V.
- Applicant Address: NL Veldoven NL Veldoven
- Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee: ASML Holding N.V.,ASML Netherlands B.V.
- Current Assignee Address: NL Veldoven NL Veldoven
- International Application: PCT/EP2015/078318 WO 20151202
- Main IPC: G03F7/20
- IPC: G03F7/20
Abstract:
An apparatus, system, and method cool a patterning device by supplying a non-uniform gas flow. The apparatus and system include a gas supply structure that supplies a gas flow across the first surface of the patterning device. The gas supply structure includes a gas supply nozzle specially configured to create a non-uniform gas flow distribution. A greater volume or velocity of the gas flow is directed to desired portion of the patterning device.
Public/Granted literature
- US10423081B2 Reticle cooling by non-uniform gas flow Public/Granted day:2019-09-24
Information query
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