A method is provided for forming an internal electromagnetic interference (EMI) shield in a mold cap formed over a printed circuit board (PCB). The method includes forming a trench in the mold cap, the trench extending continuously from a first edge of the mold cap to a second edge of the mold cap, where the trench defines a trench pattern corresponding to desired locations of the internal EMI shield. The method further includes sealing an elastomeric pad on a top surface of the mold cap to form a channel, the channel including at least the trench formed in the mold cap; and filling the channel with a conductive epoxy using a vacuum configured to draw the conductive epoxy from a dispenser, connected to the first edge of the mold cap, through the channel to the second edge of the mold cap based on pressure differential.