发明申请
- 专利标题： HEAT SEALED PACKAGING ASSEMBLIES AND METHODS OF PRODUCING AND USING THE SAME
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申请号： US15706594申请日： 2017-09-15
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公开(公告)号： US20180002095A1公开(公告)日： 2018-01-04
- 发明人: John McDonald , Frank Comerford , Myles Comerford
- 申请人： John McDonald , Frank Comerford , Myles Comerford
- 主分类号： B65D81/07
- IPC分类号： B65D81/07 ; B65D5/50
摘要：
A packaging device can include a resilient member formed of one or more layers of different materials and a frame member. The resilient member can be heat sealed to the frame member or to a coating on the surface of the frame member. The layers can he made from different materials or the same materials having different thicknesses, modules of elasticity, melting index, or other different characteristics.