- 专利标题: SEMICONDUCTOR PACKAGE HAVING A SOLDER-ON-PAD STRUCTURE
-
申请号: US15202195申请日: 2016-07-05
-
公开(公告)号: US20180012856A1公开(公告)日: 2018-01-11
- 发明人: Deog Soon Choi , Ah Ron Lee , Hyon Mo Ku
- 申请人: Avago Technologies General IP (Singapore) Pte. Ltd
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; H01L23/498
摘要:
A semiconductor package and methods for producing the same are described. One example of the semiconductor package is described to include a substrate having a first face and an opposing second face. The package is further described to include a plurality of pads disposed on the first face of the substrate, each of the plurality of pads including a first face and an opposing second face that is in contact with the first face of the substrate. The semiconductor package is further described to include a plurality of solder-on-pad structures provided on a first of the plurality of pads.
公开/授权文献
- US09972590B2 Semiconductor package having a solder-on-pad structure 公开/授权日:2018-05-15