Invention Application
- Patent Title: TRANSPARENT CONDUCTIVE FILM
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Application No.: US15546928Application Date: 2016-01-25
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Publication No.: US20180017715A1Publication Date: 2018-01-18
- Inventor: Shoichi Matsuda , Yuki Hasegawa , Hiroshi Tomohisa , Kazumasa Okada , Hiroyuki Takemoto
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP2015-013652 20150127; JP2015-052126 20150316; JP2015-179340 20150911; JP2015-179341 20150911
- International Application: PCT/JP2016/051951 WO 20160125
- Main IPC: B32B7/02
- IPC: B32B7/02 ; H01B5/14 ; G02B5/30

Abstract:
Provided is a transparent conductive film excellent in both scratch resistance and conductivity. The transparent conductive film of the present invention includes: a transparent substrate; and a transparent conductive layer arranged on one side or both sides of the transparent substrate, in which: the transparent conductive layer contains a binder resin, metal nanowires, and metallic particles; and part of the metallic particles protrude from a region formed of the binder resin. In one embodiment, an average particle diameter X of the metallic particles and a thickness Y of the region formed of the binder resin satisfy a relationship of Y≦X≦20Y.
Information query