A method for modifying metal portions of a layout data file associated with a self-aligned multiple patterning (SAMP) process. The method comprises receiving the layout data file that includes one or more active metal portions and layout information associated with an integrated circuit. The method also comprises converting the layout data file to further include mask information having at least a first set of trim features associated with one or more redundant metal portions and one or more active metal portions of the layout data file. The method also comprises determining the one or more redundant metal portions to be perforated. The method further comprises modifying the mask information to further include a second set of trim features for perforating the one or more redundant metal portions. The first set of trim features and the second set of trim features are associated with a trim mask of the SAMP process.