- 专利标题: WAFER SCOOP ASSEMBLY AND METHOD
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申请号: US15794629申请日: 2017-10-26
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公开(公告)号: US20180045632A1公开(公告)日: 2018-02-15
- 发明人: MARTIN ATCHISON
- 申请人: MARTIN ATCHISON
- 主分类号: G01N9/36
- IPC分类号: G01N9/36 ; F16L27/00 ; F16L41/08 ; F16L9/00 ; G01N1/20 ; F16L41/10
摘要:
A bidirectional scoop assembly is shown that is mountable to a pipeline for taking samples from the pipeline. A wafer flange is mounted in said pipeline surrounding the fluid flow through the pipeline. A first tubular is extendable through a first side of the wafer flange to receive a sample from the pipeline. A second tubular is extendable through a second side of the wafer flange to receive a sample from the pipeline. The first tubular and second tubular are positioned adjacent each other whereby at least a portion of a first opening of the first tubular and at least a portion of a second opening of the second tubular are axially aligned or parallel to a flow axis of the pipeline.
公开/授权文献
- US10578536B2 Wafer scoop assembly and method 公开/授权日:2020-03-03
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