A sensor for an integrated circuit (IC) structure is disclosed. The sensor includes a sensor layer in a layer of the IC structure, the sensor layer including: a first conductive structure disposed proximate a perimeter of the IC structure; and a second conductive structure disposed parallel to the first conductive structure and proximate the perimeter of the IC structure. The sensor also includes a set of interdigitating conductive elements including a first plurality of conductive elements electrically coupled to the first conductive structure interdigitating with a second plurality of conductive elements electrically coupled to the second conductive structure.