Invention Application
- Patent Title: ARRAY SUBSTRATE, CHIP ON FILM, DISPLAY PANEL AND DISPLAY DEVICE
-
Application No.: US15538712Application Date: 2016-04-29
-
Publication No.: US20180047657A1Publication Date: 2018-02-15
- Inventor: Hong LI , Liqiang CHEN
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Priority: CN201610083954.2 20160206
- International Application: PCT/CN2016/080646 WO 20160429
- Main IPC: H01L23/495
- IPC: H01L23/495 ; G02F1/1333 ; H01L27/12 ; H01L27/32 ; G02F1/1362 ; H01L23/00
Abstract:
Provided are an array substrate, a chip on film, a display panel and a display device. The array substrate has a display area and a bonding area located in a periphery of the display area. The array substrate includes a plurality of first bonding pads located in the bonding area, and length directions of the first bonding pads face the display area.
Public/Granted literature
- US10784187B2 Array substrate, chip on film, display panel and display device Public/Granted day:2020-09-22
Information query
IPC分类:
