A method is provided. The method includes removing an extracted die including an original ball bond from a previous packaged integrated circuit, bonding the extracted die to an interposer to create a remapped extracted die, 3D printing one or more first bond connections between one or more original bond pads of the extracted die and one or more first bond pads of the interposer, securing the remapped extracted die to a package base, and 3D printing one or more second bond connections between one or more second bond pads of the interposer and one or more package leads or downbonds of the package base. The one or more first and second bond connections conform to the shapes and surfaces of the extracted die, the interposer, and the package base.