Provided is a copper powder that has an increased number of points of contact between copper powder particles, that ensures excellent conductivity, and that can be suitably used in a conductive paste, an electromagnetic wave shield, or the like. The copper powder is configured from flat plate-shaped copper particles that form a dendritic shape having a linearly grown main trunk and a plurality of branches branching from the main trunk. The main trunk and the branches have an average cross-sectional thickness of more than 1.0 μm but no more than 5.0 μm. The copper powder has a flat plate shape that is configured from a layered structure of one layer or a plurality of stacked layers. The average particle size (D50) is 1.0-100 μm.