Invention Application
- Patent Title: PRESSURE-SENSITIVE ADHESIVE TAPE
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Application No.: US15563074Application Date: 2016-03-16
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Publication No.: US20180086945A1Publication Date: 2018-03-29
- Inventor: Tomohito HARADA , Bojun CHEN
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Priority: JP2015-075201 20150401; JP2015-133295 20150702; JP2015-257442 20151228
- International Application: PCT/JP2016/058292 WO 20160316
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J109/08 ; H01B7/00

Abstract:
Provided is a polyvinyl chloride (PVC) adhesive tape less susceptible to cracking at low temperatures even with thin PVC film. The pressure-sensitive adhesive (PSA) tape provided by the present invention comprises a PVC film and a PSA layer placed on at least one face of the PVC film. The PSA tape shows a tensile elongation at break of 80% or higher at −20° C.
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