Invention Application
- Patent Title: Leadframe Having Organic, Polymerizable Photo-Imageable Adhesion Layer
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Application No.: US15820266Application Date: 2017-11-21
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Publication No.: US20180096860A1Publication Date: 2018-04-05
- Inventor: Jaimal Mallory Williamson , Bernardo Gallegos , Jose Carlos Arroyo
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L23/495
Abstract:
A lead frame that is partially covered with an adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame and using a photo-imageable polyimide or epoxy material to form the adhesion layer. A method for forming a lead frame with an adhesion layer starting with a lead frame blank and using a photo-imageable polyimide or epoxy material to form the adhesion layer.
Public/Granted literature
- US10672692B2 Leadframe having organic, polymerizable photo-imageable adhesion layer Public/Granted day:2020-06-02
Information query
IPC分类:
