A high density package on package electrical device is disclosed. The electrical device comprises a first integrated circuit package comprising a substrate, an integrated circuit component attached to the substrate, and a molding compound covering the component, wherein the top of the molding compound has a redistribution layer of metal covering at least part of the molding compound. The device further comprises a second integrated circuit package including a second substrate, a semiconductor component attached to the substrate, and a molding compound covering the electronic component, wherein the bottom of the substrate includes metal contacts for communication between the second integrated circuit package and other components. The device further comprises a solder layer that connects the top of the first integrated circuit package to the bottom of the second electric package by connecting the metal of the redistribution layer to the metal connections on the bottom of the second substrate.