Invention Application
- Patent Title: FULLY INTEGRATED LOW-NOISE AMPLIFIER
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Application No.: US15833039Application Date: 2017-12-06
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Publication No.: US20180097481A1Publication Date: 2018-04-05
- Inventor: Raphael Paulin
- Applicant: STMicroelectronics SA
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Priority: FR1650888 20160204
- Main IPC: H03F1/56
- IPC: H03F1/56 ; H04B5/00 ; H03F3/195

Abstract:
A low-noise amplifier device includes an inductive input element, an amplifier circuit, an inductive output element and an inductive degeneration element. The amplifier device is formed in and on a semiconductor substrate. The semiconductor substrate supports metallization levels of a back end of line structure. The metal lines of the inductive input element, inductive output element and inductive degeneration element are formed within one or more of the metallization levels. The inductive input element has a spiral shape and the an amplifier circuit, an inductive output element and an inductive degeneration element are located within the spiral shape.
Public/Granted literature
- US10243522B2 Fully integrated low-noise amplifier Public/Granted day:2019-03-26
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