- 专利标题： NANOWIRE BUNDLE AND METHOD OF MANUFACTURING NANOSTRUCTURE
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申请号： US15730376申请日： 2017-10-11
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公开(公告)号： US20180102249A1公开(公告)日： 2018-04-12
- 发明人: Dae Hyun Kim , Jong Hyuk Kang , Hyun Deok Im , Hyun Min Cho , Yongju Kwon , Bomi Kim , Sung-Jee Kim , Mihye Lim
- 申请人： Samsung Display Co., Ltd. , POSTECH Academy-Industry Foundation
- 优先权： KR10-2016-0132288 20161012
- 主分类号： H01L21/02
- IPC分类号： H01L21/02
摘要：
A method of manufacturing a nanostructure includes: heating a mixed solution to a first temperature, the mixed solution including a solvent, a compound including indium, and an octadecylphosphonic acid; heating the mixed solution to a second temperature; injecting, after heating the mixed solution to the second temperature, a phosphine precursor into the mixed solution; and heating the mixed solution including the injected phosphine precursor to a third temperature.
公开/授权文献
- US10354869B2 Nanowire bundle and method of manufacturing nanostructure 公开/授权日：2019-07-16
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