Invention Application
- Patent Title: Method For Self-Aligning Solder-Attached Mems Die To A Mounting Surface
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Application No.: US15686343Application Date: 2017-08-25
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Publication No.: US20180127269A1Publication Date: 2018-05-10
- Inventor: Wayne C. Long , Joe A. Ojeda , Gengxun K. Gurley , Joseph L. Nguyen
- Applicant: DunAn Microstaq, Inc.
- Applicant Address: US TX Austin
- Assignee: DunAn Microstaq, Inc.
- Current Assignee: DunAn Microstaq, Inc.
- Current Assignee Address: US TX Austin
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B23K35/02
Abstract:
A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
Public/Granted literature
- US10189706B2 Method for self-aligning solder-attached MEMS die to a mounting surface Public/Granted day:2019-01-29
Information query
